Guangdong Hengjin Printing Machine is suitable for surface printing, hole filling, and wall hanging printing of electronic components such as LTCC, HTCC, MLCC, DBC/AMB ceramic substrates, electronic ceramic substrates, thick film circuits/resistors, SOFC cells, bipolar plate seals, membrane electrodes, photovoltaic cells, stacked inductors, 12 inch wafers, chip capacitors, ESC electrostatic cards, dielectric filters, electrochemical sensors, thick film sensors, and power semiconductors.